SiCarrier, the leading chip equipment manufacturer in China, has announced an ambitious lineup of chipmaking tools designed to boost domestic semiconductor production capabilities.
In recent times, China’s semiconductor industry has seen significant growth, driven largely by the nation’s determination to reduce reliance on Western technology. Companies such as Huawei and SMIC have made strides in establishing China’s independent chip production infrastructure. However, a key player that doesn’t receive enough recognition is SiCarrier, reportedly backed by Huawei, specializing in creating chipmaking tools. At the SEMICON 2025 event in China, SiCarrier showcased its next wave of equipment, making it clear that they’re geared up to break new ground.
Sharing the buzz from SEMICON 2025, Twitter user @zephyr_z9 revealed that SiCarrier’s latest catalog includes a variety of chipmaking tools, notably RTP (Rapid Thermal Processing) systems essential for semiconductor fabrication of integrated circuits. While the catalog includes many tools, none address lithography, a possible strategic choice by SiCarrier to maintain an element of surprise. This array of products marks a significant attempt to rival established giants like ASML, Applied Materials, and Lam Research, although the effectiveness of these tools within China’s market remains to be seen.
During the event, SiCarrier’s President, Du Lijun, spoke about how domestic chipmaking tools are capable of producing 5nm chips. However, limitations in yield rates due to reliance on non-optical technology could make the production costlier than international standards. SiCarrier is collaborating with SMIC and Huawei to seek feasible solutions, and considering China’s pressing goal of semiconductor self-sufficiency, significant advancements can be anticipated.
In a statement echoed by Reuters, Du Lijun mentioned, “There might be a path where we can use non-optical technologies, that is, using our process equipment to solve some of the lithography issues.” This indicates ongoing efforts to overcome current technological barriers.
SiCarrier’s overarching goal is to reshape the semiconductor landscape, reducing reliance on nations like the Netherlands, which has been a major supplier of chipmaking machinery. A report has revealed that SiCarrier, in partnership with Huawei and the Shenzhen government, is developing custom EUV prototypes featuring laser-induced discharge plasma (LDP). This initiative represents China’s first steps towards establishing its own EUV lithography technology, which is a crucial component for producing state-of-the-art semiconductor nodes.
